AMD is facing challenges at the beginning of the week due to a legal process involving the technologies used in its processors, particularly the hybrid connection seen in its 3D V-Cache CPUs. Adeia has accused AMD of violating 10 of their intellectual properties.
Three of the intellectual properties pertain to processor nodes and memory production, while seven are associated with hybrid bonding technology. This technology is utilized in the Ryzen X3D series of processors, expected to introduce new models at CES 2026.
The hybrid link enables the stacking of up to 64MB of SRAM per computing die (CCD) using Zen architecture, without overheating or overvoltage issues. Tom’s Hardware indicates that manufacturing would utilize the TSMC SoIC process, potentially involving the semiconductor manufacturer in patent disputes.
Adeia holds multiple patents related to hybridization and networking, and typically grants permission to electronic manufacturers to use its technologies. The company claims that AMD is extensively utilizing methods covered by its patents.
The AMD processor can affect various upcoming components.
The Adeia process is unlikely to have a significant impact on AMD’s current products, but it could influence the future of components not just from AMD but also from other brands.
Depending on how Justice interprets what falls under the protection of the company’s patents, any hybrid-binding processor could be impacted. This includes Intel, which employs a form of hybrid connection in Foveros Direct even though they have not explicitly mentioned 3D V-Cache.
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The outcome hinges on how the process unfolds, starting from its early stage and possibly not proceeding further in the U.S. legal system. Adeia has indicated its readiness to engage in discussions for a fair and reasonable settlement with AMD.
